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2STD1665 Low voltage fast-switching NPN power transistor General features Very low collector to emitter saturation volatage High current gain characteristic fast-switching speed Through-hole IPAK (TO-251) power package in tube (suffix"-1") Surface mounting DPAK (TO-252) power package in tape & reel (suffix"T4") 1 3 2 3 1 IPAK TO251 ( Suffix "-1" ) DPAK TO252 ( Suffix "T4" ) Applications Ccfl drivers Voltage regulators Relay drivers High efficiency low voltage switching applications Internal schematic diagrams Description The device is manufactured in NPN Planar Technology by using a "Base Island" layout. The resulting transistor shows exceptional high gain performance coupled with very low saturation voltage. Order codes Part Number 2STD1665T4 2STD1665-1 Marking D1665 D1665 Package DPAK IPAK Packing Tape & reel Tube May 2006 Rev 1 1/12 www.st.com 12 2STD1665 Contents 1 2 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 2.2 Electrical characteristics (curves) ........................... 5 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2/12 2STD1665 1 Electrical ratings Table 1. Symbol VCBO VCEO VEBO IC ICM IB Ptot Tstg TJ Absolute maximum rating Parameter Collector-base voltage (IE = 0) Collector-emitter voltage (IB = 0) Emitter-base voltage (IC = 0) Collector current Collector peak current (tP < 5ms) Base current Total dissipation at T c = 25C Storage temperature Max. operating junction temperature Value 150 65 7 6 20 1 15 -65 to 150 150 Unit V V V A A A W C C Table 2. Symbol Rthj-amb Thermal data Parameter Thermal resistance junction-amb __max Value 8.33 Unit C/W 3/12 Electrical characteristics 2STD1665 2 Electrical characteristics (Tcase = 25C unless otherwise specified) Table 3. Symbol ICBO IEBO Electrical characteristics Parameter Test Conditions Min. Typ. Max. Unit 50 1 10 nA A nA Collector cut-off current VCB = 120V (IE = 0) VCB = 120V Emitter cut-off current (IC = 0) VEB = 7V TJ = 100C Collector-base V(BR)CBO (1) breakdown voltage (IE = 0) Collector-emitter V(BR)CEO (1) breakdown voltage (IB = 0) Emitter-base V(BR)EBO (1) breakdown voltage (IC = 0) IC = 100A 150 V IC = 10mA 65 V IE = 100A IC = 100mA IB = 5mA IB = 50mA IB = 50mA IB = 150mA IB = 300mA IB = 200mA VCE = 1V VCE = 1V VCE = 1V VCE = 1V VCE = 1V f = 1MHz 7 50 70 140 290 320 1 0.89 150 150 90 30 300 270 140 50 47 350 1.15 1 380 350 V V V V V V V V VCE(sat) (1) Collector-emitter saturation voltage IC = 1A IC = 2A IC = 6A IC = 6A VBE(sat) (1) VBE(on) (1) Base-emitter saturation IC = 4A voltage Base-emitter On voltage IC = 4A IC = 10mA hFE DC current gain IC = 2A IC = 5A IC = 10A CCBO Collector-base capacitance Resistive load Turn-on time Storage time Fall time VCB = 10V pF tON ts tf 1. IC = 3A IB1 = -IB2 = 0.3A VCC = 10V 90 800 90 ns ns ns Pulsed duration = 300 s, duty cycle 1.5%. 4/12 2STD1665 2.1 Electrical characteristics (curves) Figure 1. Output characteristics Figure 2. Derating Curve Figure 3. DC current gain Figure 4. Collector-emitter saturation voltage Figure 5. Collector-emitter saturation voltage Figure 6. Base-emitter saturation voltage 5/12 Electrical characteristics 2STD1665 Figure 7. Base-emitter on voltage Figure 8. Switching times resistive load Figure 9. Switching times resistive load Figure 10. Switching times resistive load Figure 11. Switching times inductive load Figure 12. Switching times inductive load 6/12 2STD1665 2.2 Test circuits Figure 13. Resistive load switching and RBSOA test circuit 1) Fast Electronic Switching 2) Non-inductive Resisitor 7/12 Package mechanical data 2STD1665 3 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 8/12 2STD1665 TO-251 (IPAK) MECHANICAL DATA DIM. A A1 A3 B B2 B3 B5 B6 C C2 D E G H L L1 L2 V1 0.45 0.48 6.00 6.40 4.40 15.90 9.00 0.80 0.80 10o 0.30 0.95 0.60 0.60 6.20 6.60 4.60 16.30 9.40 1.20 1.00 0.018 0.019 0.237 0.252 0.173 0.626 0.354 0.031 0.031 10o mm MIN. 2.20 0.90 0.70 0.64 5.20 TYP. MAX. 2.40 1.10 1.30 0.90 5.40 0.85 0.012 0.037 0.024 0.024 0.244 0.260 0.181 0.642 0.370 0.047 0.039 MIN. 0.087 0.035 0.028 0.025 0.204 inch TYP. MAX. 0.094 0.043 0.051 0.035 0.213 0.033 P032N_E 9/12 Package mechanical data 2STD1665 TO-252 (DPAK) MECHANICAL DATA DIM. MIN. A A1 A2 B B2 C C2 D E G H L2 L4 V2 0.60 0o 2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 6.40 4.40 9.35 0.8 1.00 8o 0.024 0o mm TYP. MAX. 2.40 1.10 0.23 0.90 5.40 0.60 0.60 6.20 6.60 4.60 10.10 MIN. 0.087 0.035 0.001 0.025 0.204 0.018 0.019 0.236 0.252 0.173 0.368 0.031 0.039 0o inch TYP. MAX. 0.094 0.043 0.009 0.035 0.213 0.024 0.024 0.244 0.260 0.181 0.398 P032P_B 10/12 2STD1665 4 Revision history Table 4. Date 08-May-2006 Revision history Revision 1 Initial release. Changes 11/12 2STD1665 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. 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